
: FUJI IP III E FINE PITCH COMPONENT PLACEMENT SYSTEM
Speed: 7,000cph
MAX PCB 457 x 356 MM
Board Loading - 5 secs approx
Component Range: 1005 (0402) chips to 74mm QFP
Capable of placing TAB BGA etc
Placement accuracy of ±0.025 mm
Multi-Tray Unit
Multi-Feeder Units
: MPM H.I. SCREEN PRINTER
: BTU VIP98 REFLOW OVEN
: PANASONIC SP22 P-M SCREEN PRINTER
: ELECTROVERT OMNIFLOW5 REFLOW OVEN
: SRT SIERRA SUMMIT 1000 BGA REWORK STATION
: DEDICATED ESD ROOM
: METCAL IRONS
: KEYENCE VH-6300 DIGITAL MICROSCOPE